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MEMSnet Home: MEMS-Talk: Liftoff Process Using LOR 10B and 1800 Series Resist
Liftoff Process Using LOR 10B and 1800 Series Resist
2015-07-13
Joshua Wells
2015-07-14
Bill Moffat
2015-07-14
André Bödecker
2015-07-14
Joshua Wells
2015-07-17
Dr. Gabriel Puebla-Hellmann
2015-07-14
Bill Moffat
2015-07-17
Wilson, Thomas
2015-07-14
Gary Hillman
Liftoff Process Using LOR 10B and 1800 Series Resist
Gary Hillman
2015-07-14
Joshua, We have tools in the field performing this develop process with good
process control.  The key factor is the way the develop process is done and
using a spray technique or streaming dispense will not work.  We rapidly build a
puddle with zero impact and the agitate the puddle inorder to refresh chemistry
at the surface being "etched" by the developer.  Gary



Gary Hillman
S-Cubed
9 Mars Court ( USPS PO Box 365)
Montville, NJ 07045

Phone 973-263-0640 ex 535
Mobile 201-755-3760



________________________________________
From: [email protected] [mems-talk-
[email protected]] on behalf of Joshua Wells
[[email protected]]
Sent: Friday, July 10, 2015 7:42 AM
To: [email protected]
Subject: [mems-talk] Liftoff Process Using LOR 10B and 1800 Series Resist

I am trying to develop a repeatable liftoff process using LOR10B and an
1800 series positive resist for use with 1:1 microdev developer (necessary
for material compatibility). The trouble arises in the repeatability of the
process. Time of development varies significantly between runs with no
process parameters changing yielding far too much undercut for our
application. We have the LOR thinner and have by trying to work with that
as well as full thickness LOR.

Does anyone have a repeatable process or suggestions?


Joshua
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Visit us at http://www.mems-exchange.org

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