Mehmet,
I think make sure you haven't spin coat the HMDS. Only incubate the wafer
together with 3-4 drops of HMDS in vacuum desicater.
Good luck
On Sep 24, 2015 11:54 AM, "James Guenes"  wrote:

> Mehmet,
> your problem is the combination of thickness combined with HDMS.
>
> Potential Solution:
> Have a list of the properties of the HDMS and find a compound that will not
> insist to stick to the matter for a very long time, which means you have to
> conduct experiments with various solutions under tightly controlled
> environments.
>
> All the best of luck to you, I hope that my observation was a little
> insightful,
>
> On Mon, Sep 21, 2015 at 5:24 AM, Mehmet Yilmaz 
> wrote:
>
> > Dear mems-talk community,
> > If I use HMDS as adhesion layer, I am having a problem with the
> development
> > of a photoresist called AZ4562 (about 10 micron thickness). In addition,
> I
> > am having the same development problem with AZ5214E (about 1.4 micron
> > thickness).
> >
> > If I do not use HMDS, the development time is usually about 60 seconds,
> or
> > even less. However, if I use HMDS, the development time goes up to 45
> > minutes (not seconds...) and still the development is not successful, but
> > the resist is completely removed from some parts of the patterned areas
> on
> > the wafer.
> >
> > Also, I have seen this problem with different substrates such as Silicon,
> > Quartz, and Pyrex.
> >
> > I am wondering what would be the reason for that? Is it possible that
> HMDS
> > is old, and out of date? Could that explain the problem? Or, do you have
> > any other comments based on your own experience? Could you please
> comment?
> >
> > I am looking forward to your replies.
> >
> > Thanks in advance,
> >
> > Mehmet
> >
> > Mechanical Engineer
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>
>
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