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MEMSnet Home: MEMS-Talk: About difficulty in photoresist development (if using HMDS as adhesion layer)
About difficulty in photoresist development (if using HMDS as adhesion layer)
2015-09-23
Mehmet Yilmaz
About difficulty in photoresist development (if using HMDS as adhesion layer)
2015-09-24
Bill Moffat
About difficulty in photoresist development (if using HMDS as adhesion layer)
2015-09-24
André Bödecker
About difficulty in photoresist development (if using HMDS as adhesion layer)
2015-09-24
James Guenes
2015-09-25
Liang Zhao
2015-09-25
Orozaliev Ajymurat Nurdinovich
2015-09-29
Mehmet Yilmaz
About difficulty in photoresist development (if using HMDS as adhesion layer)
2015-09-25
Mohammad Yusuf Mulla
About difficulty in photoresist development (if using HMDS as adhesion layer)
2015-09-29
Andrew Sarangan
2015-09-30
Mehmet Yilmaz
2015-10-04
Andrew Sarangan
2016-01-04
Mehmet Yilmaz
2016-01-04
조명래
2016-01-04
ozgur celik
2016-01-05
André Bödecker
2015-09-25
Brian Baker
About difficulty in photoresist development (if using HMDS as adhesion layer)
Brian Baker
2015-09-25
Mehmet,



It sounds like you may be using undiluted HMDS which can react with your
photoresist and render it undevelopable.  We usually dilute our HMDS with
Xylene (80:20 Xylene: HMDS) before the dispense/spin cycle.  A 3000 rpm, 60
second spin cycle with the diluted HMDS should leave a layer that will
improve adhesion without affecting the photoresist that is subsequently
spin-coated.



Best,



Brian Baker

Utah Nanofab





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