What you describe as pin holes is probably actually tiny bubbles, which are
expanding when heated and becoming visible. The bake instructions given in
the datasheet are far too optimistic in my opinion. I normally do a 30
minute ramp to 90C and another two hours to ramp down. Spraying some
cyclopentanone before the bake will also remove most of the trapped gases.





On Fri, Oct 16, 2015 at 11:49 PM, KarthiKeyan K 
wrote:

> Dear Friends,
>
> Please suggest how to avoid pin holes on SU8 2075 photoresist layer during
> Pre & Post baking process at 65C & 95C temperature (temperature has
> followed as per the data sheet instructions).
>
> There is no pi holes and air bubbles during spin process but i can see 1
> or 2 pin holes under the size is 300-500 microns so please give me the
> suggestion for the same.
>
> --
>
> Thanks & Best Regards,
> *KarthiKeyan K*
> Mobile No: +91-9944477213
> Email ID: [email protected] 
>
> ​
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>
>
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_______________________________________________
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