Dear mems-talk community,

Question about anodic wafer bonding of "silicon to aluminum oxide
coated borosilicate glass (Pyrex)"

We are planning to wafer bond silicon wafer surface to borosilicate glass
substrate surface via anodic bonding. It seems that this is well known, and
documented. Although it is well known, this may bring some complications to
our integration process flow. Because of these complications, we are
looking for alternative approaches that may be tried to reduce the
complications in the integration process.

An idea that we have that will reduce some process steps and complications
is below:

Our integration process directs us to think about wafer bonding of silicon
substrate to 15nm aluminum oxide coated borosilicate glass (Pyrex). In case
you wonder, 15nm aluminum oxide is ALD (Atomic layer Deposition) coated on
Pyrex.

We wonder if anyone of you have any experience with wafer bonding of
silicon substrate to aluminum oxide coated borosilicate glass (Pyrex), or a
similar material stack? If you do not have direct experience, comments
based on your anodic wafer bonding experience are also very welcome.

Regards, and thanks in advance,

Mehmet Yilmaz
Mechanical Engineer
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