Dear Maksym,
Several more comments:
3. It may be a good idea to make sure that your wafer is fully dry before
spinning adhesion promoter as well as PR. You may keep the wafers at high
temperatures for 30 minutes...
4. If AZ5214E is not satisfying your requirements in terms of BOE etch and
PR separation from surface, try a thicker PR such az AZ5462.

I hope these help as well.

Regards,

Mehmet
On Jun 9, 2016 10:11 PM, "Mehmet Yilmaz"  wrote:

> Dear Maksym,
> Based on my own experience, you may have the problem due to the following
> reasons:
> 1. PR features are probably narrow, so that BOE kind of lifts-off the
> narrow PR features.
> 2. BOE etch time is too long for the width of your PR features.
>
> I assume that you are using an adhesion promoter before spinning PR.
>
> I hope this helps...
>
> Sincerely,
>
> Mehmet
> On Jun 9, 2016 9:55 PM, "Maksym Plakhotnyuk"  wrote:
>
>> Hi All
>>
>> I face a problem of keeping AZ5214e photoresist on top of Al2O3 film
>> during BHF etch.
>> I have done post bake of PR at 150C for 30 min however it still does not
>> help.
>> Does any of you know the solution or any idea how to keep PR On top of
>> alumina during BHF etch?
>>
>> Thank you in advance
>>
>> Best regards
>> Maksym Plakhotnyuk
>> PHD student at DTU
>>
>>
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