It is a classic problem of the surface being too hydrophilic. HF penetrates
the resist/substrate interface and lifts everything off. You need to prime
the substrate to reduce the water droplet contact angle to about 60-70deg,
and then apply the resist.



On Wed, Jun 8, 2016 at 1:43 PM, Maksym Plakhotnyuk 
wrote:

> Hi All
>
> I face a problem of keeping AZ5214e photoresist on top of Al2O3 film
> during BHF etch.
> I have done post bake of PR at 150C for 30 min however it still does not
> help.
> Does any of you know the solution or any idea how to keep PR On top of
> alumina during BHF etch?
>
> Thank you in advance
>
> Best regards
> Maksym Plakhotnyuk
> PHD student at DTU
>
>
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