AZ5214E photoresist adhesion problem on Al2O3 coated Si wafers
Mehmet Yilmaz
2016-06-15
Dear Maksym,
Based on my own experience, you may have the problem due to the following
reasons:
1. PR features are probably narrow, so that BOE kind of lifts-off the
narrow PR features.
2. BOE etch time is too long for the width of your PR features.
I assume that you are using an adhesion promoter before spinning PR.
I hope this helps...
Sincerely,
Mehmet
On Jun 9, 2016 9:55 PM, "Maksym Plakhotnyuk" wrote:
> Hi All
>
> I face a problem of keeping AZ5214e photoresist on top of Al2O3 film
> during BHF etch.
> I have done post bake of PR at 150C for 30 min however it still does not
> help.
> Does any of you know the solution or any idea how to keep PR On top of
> alumina during BHF etch?
>
> Thank you in advance
>
> Best regards
> Maksym Plakhotnyuk
> PHD student at DTU
>
>
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