Dear mems-talk community,
We have a standard Si wafer that we would like to dice into smaller 1cm x
1cm square pieces.

The challenge is below:
1. We have very delicate structures on the Si wafer. So, we cannot flow
*strong* air and/or water on Si wafer while dicing. The *strong* flow of
air/wafer damages the delicate structures.* Here, it is very important to
emphasize that, the main contributors to the damage are strong water flow
and/or strong air flow.*

As part of the solution,
We can sacrifice a blade of a dicing saw (~30 USD), and just try to dice
the wafer without water/air flow. However, we are concerned that we may be
damaging more than just the blade of the dicing saw when we do not let
air/water flow during dicing. In case you wonder, the dicing saw is from
DISCO, and the type is DAD3220.

Also,
We may try spinning photoresist on the wafer to protect the delicate
structures, but we are reluctant about spinning photoresist as well, due to
some requirements on the final structures.

Any comments from you who might have had this or similar experience in the
past or currently, would really be appreciated.

Thanks in advance.

Regards,

Mehmet Yilmaz
Mechanical Engineer
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