Using DAD3220 Dicing Saw without water and air flow
Yongliang Yang
2016-06-20
Hi Mehmet,
I think the laser dicing should be able to solve your problem.
Disco has stealth laser dicing. The laser is focused into the wafer and
modifies the crystal structure. After dicing, the chips can be easier
separated by expanding the wafer tape.
Best,
Yongliang
On Monday, June 20, 2016, Mehmet Yilmaz wrote:
> Dear mems-talk community,
> We have a standard Si wafer that we would like to dice into smaller 1cm x
> 1cm square pieces.
>
> The challenge is below:
> 1. We have very delicate structures on the Si wafer. So, we cannot flow
> *strong* air and/or water on Si wafer while dicing. The *strong* flow of
> air/wafer damages the delicate structures.* Here, it is very important to
> emphasize that, the main contributors to the damage are strong water flow
> and/or strong air flow.*
>
> As part of the solution,
> We can sacrifice a blade of a dicing saw (~30 USD), and just try to dice
> the wafer without water/air flow. However, we are concerned that we may be
> damaging more than just the blade of the dicing saw when we do not let
> air/water flow during dicing. In case you wonder, the dicing saw is from
> DISCO, and the type is DAD3220.
>
> Also,
> We may try spinning photoresist on the wafer to protect the delicate
> structures, but we are reluctant about spinning photoresist as well, due to
> some requirements on the final structures.
>
> Any comments from you who might have had this or similar experience in the
> past or currently, would really be appreciated.
>
> Thanks in advance.
>
> Regards,
>
> Mehmet Yilmaz
> Mechanical Engineer
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