One thing to try would be to use dice saw tape to  make a cavity over your
structure and dice through the tape and peel of the tape after dice.

Rick


-----Original Message-----
From: [email protected] [mailto:mems-talk-
[email protected]] On Behalf Of Mehmet Yilmaz
Sent: Monday, June 20, 2016 3:12 AM
To: General MEMS discussion 
Subject: [mems-talk] Using DAD3220 Dicing Saw without water and air flow

Dear mems-talk community,
We have a standard Si wafer that we would like to dice into smaller 1cm x 1cm
square pieces.

The challenge is below:
1. We have very delicate structures on the Si wafer. So, we cannot flow
*strong* air and/or water on Si wafer while dicing. The *strong* flow of
air/wafer damages the delicate structures.* Here, it is very important to
emphasize that, the main contributors to the damage are strong water flow and/or
strong air flow.*

As part of the solution,
We can sacrifice a blade of a dicing saw (~30 USD), and just try to dice the
wafer without water/air flow. However, we are concerned that we may be damaging
more than just the blade of the dicing saw when we do not let air/water flow
during dicing. In case you wonder, the dicing saw is from DISCO, and the type is
DAD3220.

Also,
We may try spinning photoresist on the wafer to protect the delicate structures,
but we are reluctant about spinning photoresist as well, due to some
requirements on the final structures.

Any comments from you who might have had this or similar experience in the past
or currently, would really be appreciated.

Thanks in advance.

Regards,

Mehmet Yilmaz
Mechanical Engineer
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