Hi Mehmet,

Laser cutting should be a appropriate techno.
Ultrasonic as well, specially because it's far cheaper.
We might realize a test on a sample
Regards
Patricia

> From: [email protected]
> Date: Mon, 20 Jun 2016 10:11:52 +0300
> To: [email protected]
> Subject: [mems-talk] Using DAD3220 Dicing Saw without water and air flow
>
> Dear mems-talk community,
> We have a standard Si wafer that we would like to dice into smaller 1cm x
> 1cm square pieces.
>
> The challenge is below:
> 1. We have very delicate structures on the Si wafer. So, we cannot flow
> *strong* air and/or water on Si wafer while dicing. The *strong* flow of
> air/wafer damages the delicate structures.* Here, it is very important to
> emphasize that, the main contributors to the damage are strong water flow
> and/or strong air flow.*
>
> As part of the solution,
> We can sacrifice a blade of a dicing saw (~30 USD), and just try to dice
> the wafer without water/air flow. However, we are concerned that we may be
> damaging more than just the blade of the dicing saw when we do not let
> air/water flow during dicing. In case you wonder, the dicing saw is from
> DISCO, and the type is DAD3220.
>
> Also,
> We may try spinning photoresist on the wafer to protect the delicate
> structures, but we are reluctant about spinning photoresist as well, due to
> some requirements on the final structures.
>
> Any comments from you who might have had this or similar experience in the
> past or currently, would really be appreciated.
>
> Thanks in advance.
>
> Regards,
>
> Mehmet Yilmaz
> Mechanical Engineer
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