Lift-off with a sputtered metal layer doesn't sound feasible to me.
Evaporation and lift-off would work in principle, but since your
substrate is huge (and therefore the evaporator) I would recommend to
sputter Al ontop of the glass substrate, then you define the grid
lithographically by means of a laser (fixed beam moving stage). And
finally you develope the photoresist and etch the Al layer both in an
alkaline developer.

Best regards,

Philipp



Am 29.06.2016 um 02:56 schrieb John Bohland:
> I am interested in making a metal grid on a 370 mm X 470 mm glass substrate.
>
> The problem is that the metallization lines must be only 1.5 microns in width
and spaced (pitch) only a few microns apart.
>
> The metal can be Al or Ag and 100 nm thick.
>
> The best idea I have is to monolithically coat the glass with sputtered (PVD)
Al or Ag then use a picoseond laser to remove all but the desired 1.5 micron
wide metal line widths. Even then I don't know if the laser would have good
enough resolution to meet these requirements.
>
> Anyone have better ideas?
>
> Thanks,
>
> John
>
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--
Philipp Altpeter
Fakultät für Physik der Ludwig-Maximilians-Universität und
Center for NanoScience (CeNS)
Lehrstuhl für Festkörperphysik Prof. J. P. Kotthaus
Geschwister-Scholl-Platz 1
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