Kai,

The Electronic Visions EV500 series of bonders can be configured in a
variety of ways for anodic bonding, while maintaining uniform pressure
during bonding. Our design and manufacturing center in Schaerding, Austria
(+43 7712 53 11-0) can help you with any custom requirements for your bond
process.

As you are probably aware, Electronic Visions and its high-volume production
partners have produced tens of millions of anodically bonded MEMS devices on
the EV500 series of bonders. I would refer to the article published in
SENSORS on this matter by Electronic Visions and MIT - A.R. Mirza and A.A.
Ayon, SENSORS, December 1998, Vol 15, No 12, p24-33.

Please e-mail [email protected] (mailto:[email protected] ) for copy of
this review paper on silicon wafer bonding.

Regards,
Andy Mirza
Technology Manager
Electronic Visions, Inc.
3701 E. University Drive
Ste. 300
Phoenix, AZ 85034
Tel: (602) 437-9492
Fax: (602) 437-9435
E-mail: [email protected]
Web: http://www.elvisions.com

=======================================
> -----Original Message-----
> From: Kai Hiltmann [SMTP:[email protected]]
> Sent: Wednesday, July 21, 1999 9:14 AM
> To:   [email protected]
> Subject:      Die-Bonder EV 500
>
> Hi,
> Does anyone of the list members employ an Electronic Visions anodic
> bonder EV 500?
> We are thinking about building a point electrode for our machine but
> would prefer to use an existing construction.
> The electrode should apply voltage to a point in the center of the
> wafer and apply pressure evenly over the whole wafer surface.
> Yours sincerely, Kai Hiltmann
>
> mailto:[email protected]    http://www.HSG-IMIT.de
> K. Hiltmann; HSG-IMIT; Sensorics Section
> W.-Schickard-Str. 10; D-78052 Villingen-Schwenningen
> Phone ++49-7721-943-132; Fax ++49-7721-943-210
>