Joe
Since MEMS is still considered in its infancy no books exist as to be related to
MEMS itself. Packaging should be similar to regular IC packaging dependant upon
the usage of the MEMS device. I know that accelerometers are packaged the same
as non-MEMS based. With new types of devices this area may need to be
researched.
MEMS quality, this also is in even more of an infancy stage than mainstream
MEMS. Quality of MEMS is relivant to its utilization. If it is simplistic, you
could probably use conventional semiconductor quality to analyze. Your more
specialty items or more complex will require material analysis that has only
just recently been done in the industry, and it is still far from being very
usefull for any modeling.
You could start by doing a search on the internet for MEMS Quality or MEMS
Reliability. Also try Sandia National Lab web site they are doing some research
into MEMS quality and reliability.
http://www.mdl.sandia.gov/Micromachine/index.html
There are other sites out there especially colleges and universities doing
research, but most are just beginning their projects.
James W. Carroll Jr.
Reliability Engineer
Product Assurance Dir.
Missile Research, Developement
and Engineering Center
US Army Aviation and Missile Command
____________________Reply Separator____________________
Subject: MEMS Packaging and Quality Assurance
Author: Joe Bradley
Date: 8/30/99 1:01 PM
Hey Fellow Researchers,
I am currently literature review for information regarding Packaging and
Quality Assurance testing for MEMS. Does anyone know of any publications or
books that could provide some information.
Thanks,
Joe Bradley
--------------------------
Joe A. Bradley
Engineering Animation Inc.
2321 North Loop Drive
Ames, IA 50010
515-296-6071
1-888-324-3423
--------------------------
"I am what I am by the Grace of God"
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