5..10um metal layer on silicon?

We are looking for a way to apply a thick (5..10um) layer of high-Z
material (such as gold, tungsten, platinum, lead etc.) to a
structured silicon surface (110 silicon wafer with a 100um-pitch,
25mm long etched grids. The grooves of the grid go right through
the wafer (400um deep)). We cannot use any wet process (such as
electroplating) since this would damage the grid during drying.

Any help is appreciated.


Adrian


Adrian Kohlbrenner
Institute for Biomedical Engineering
Swiss Federal Institute of Technology
Zurich, Switzerland