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MEMSnet Home: MEMS-Talk: Laser cutting (or die sep. for fragile die)
Laser cutting (or die sep. for fragile die)
1999-11-10
Steven F. Nagle
Laser cutting (or die sep. for fragile die)
Steven F. Nagle
1999-11-10
Hello to everyone,
I searched through the archives of these groups but did not find references
to specific services, so here is my question.

Could you please send the names and numbers of any laser cutting services
known to you, any area of the country is fine.  I'd like to use this method
to separate some die which contain very fragile mechanical devices and are
also very sensitive to moisture.  I am assuming that laser methods (optical
or "CO2 lasers") are fairly gentle.  A typical die saw could ruin my devices.

Also, if you know of gentle die-sep methods other than the above, please
send information.

Thank you,
-Steven


~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~
Steven F. Nagle
Ph.D. Candidate
Room 10-007                                  [email protected]
Massachusetts Institute of Technology         Tel: 617-253-2011
77 Massachusetts Avenue                       Fax: 707-215-2906
Cambridge, MA 02139
===============================================================

     "Stanley looked quite bored and somewhat detached,
                but then penguins often do."


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