> Hello,
>
> We are developing MEMS devices and we are planning to buy a system for
> deep silicon etching. The most interesting systems are based on Bosch
> process.  Can someone tell his/her experiences of different systems
> (Plasma-Therm, Alcatel, STS, Oxford)? Has anybody compared different
> systems?  For example reliability of systems, repeatability of process etc.
> Any comments are welcome.
>
> Thank you,
>
> Jani Karttunen
> Email: [email protected]
>
>
>
>

I've talked to Oxford about PECVD systems, but do not believe they liscenced
the Bosch process, but instead used cryo-RIE. But cannot get as deep as
channels.

--
Dr. Kevin M. Walsh
Electrical Engineering Department, Speed Scientific School
University of Louisville, Louisville, KY 40292
(502) 852-0826

Internet address: [email protected]