Christophe,
My name is Conor Quinn and I am the European Marketing Manager for BCO
Technologies.
We are a manufacturer of 100mm, 125mm and 150mm "value-added" SOI substrates.
We produce silicon films from 2um-150um with +/-0.5um accuarcy on film
thickness.
Our key technologies are wafer bonding and deep silicon trench etching.
We have wafer grinding and polising capability which allows us to produce
wafers of submicron TTV.
Therfore to answer your questions specifically :
1. We can supply SOI wafers with silicon layers > 2um.
2. We can grind wafers with submicron TTV (Total Thickness Variation). We have
polished wafers as thin as 350um. Depending on the quantity of wafers you
require we may be able to offer wafer grinding and polishing as a service to
you.
I would be interested to know a little more about your project. Perhaps you
can tell me.
Check our website below and if you need any further information please do not
hesitate to contact me.
Regards
Conor.
***********************************************
Conor Quinn (European Marketing Manager)
BCO Technologies
339, Glen Road
Belfast
BT11 8BU.
Northern Ireland.
T +44 1232 615599 x247
F : +44 1232 602088
http://www.BCO-Technologies.com
***********************************************
-----Original Message-----
From: PC :[email protected] [SMTP:PC
:[email protected]]
Sent: 02 February 1999 06:49
To: [email protected]
Subject: Si wafers
Dear MEMS collegues:
Can you tell me the commercial source of best quality/price Silcone
wafers. I research 3 categories of wafer:
1. test wafers of 200~500 micron thick. Not specially flat but chip.
2. high quality flatness.
3. SOI wafers.
The source can be in Europe (France ?) or US.
Sincerely,
Christophe Gorecki
--
*******************************************************************
Dr. Christophe Gorecki, Senior Researcher
Laboratoire d'Optique P.M. Duffieux,Universiti de Franche-Comti
16 Rte de Gray, 25030 Besangon Cedex, France
Tel: +33-3-81666594, fax: 33-3-81666423
e-mail: [email protected]