Avinash:

As Steve mentioned in his email FIB based micro-machining  can be the other
alternative to avoid undercutting. Also few other advantages of FIB based
MEMS device Processing are:

1. Ideal tool for sub-50 nm devices with very high aspect ratio
2. In-situ high precision metal deposition capability
3. In-situ Enhanced selective etching capability

We at Norsam Technologies have developed this technology and are currently
conducting joint R&D work with Los Alamos Lab and JPL. Also we are working
with LSU to generate sub-20 nm devices with aspect ratios of 1:100 using FIB
and X-Ray synchrotron technology. I would like to discuss with you future
about what your needs are. Thank you and am looking forward to hearing from
you. You can reach me at 503-640-0586 (feel free to check our website
http://www.norsam.com)

Regards
Jayant
******************************************************************
Jayant Neogi
Vice President & Chief Technical Officer
Norsam Technologies
Ph#  (503) 640-0586
Fax# (503) 640-8117
******************************************************************

-----Original Message-----
From: Steve Rosenberg 
To: [email protected] 
Date: Sunday, February 21, 1999 11:25 PM
Subject: Re: Ion Milling as an Alternative to Wet/Dry Etching of Aluminum


>You can use FIB (Focused Ion Beam) Systems to mill and make parts for MEMS.
>FIB is like an NC tool on a nanometer scale. If you need services (i.e.
>don't want to buy the machine yourself) in doing MEMS work using this tool
>you can contact Norsam at 503-640-3367.
>
>We at Deschutes Corporation make components for the FIB and SEM industry
and
>are in the process of investigating FIB systems dedicated to MEMS work
>(prototyping or production). If anyone have any feedback on this subject
>please let me know.
>
>The FIB systems of today are targeted to the semiconductor industry
(Failure
>Analysis and Edit of IC's).
>
>Best regards,
>Steve Rosenberg
>Deschutes Corporation
>17400 SW Upper Boones Ferry Rd #240
>Durham OR 97224
>(503) 443-3602 Fax: (503) 443-2353
>Email: [email protected]
>
>-----Original Message-----
>From: [email protected] 
>To: [email protected] 
>Date: Friday, February 19, 1999 11:42 AM
>Subject: Ion Milling as an Alternative to Wet/Dry Etching of Aluminum
>
>
>>     Hello everyone,
>>
>>     I'm currently working on process development for a multilayer
>>     microwave integrated circuit. My final metallization layer is
>>     aluminum, and I would like to minimize undercutting, so I am
>>     considering a Barium Chloride type of dry etching procedure,
>>
>>     However, I recently learned about the ion-milling technique. It
claims
>>     to have virtually no undercut, and high yields. A careful choice of
>>     photoresist must be made as the process generates much heat.
>>
>>     Anyone have any experience with ion milling? I would appreciate a
list
>>     of references, and some advice as to if this process is suitable for
>>     microwave integrated circuits. I've already consulted the Jan '85
>>     paper from Microwaves and RF.
>>
>>     Thanks in advance,
>>
>>     Avinash Kane
>>     Raytheon Systems Company
>>     Solid State Microwave
>>     Fullerton, California
>>     [email protected]
>>
>>
>>
>
>
>