Dear Colleague,

 We have experiences of electroforming nickel shadow masks.
Using lithography with thick photoresist or standard photoresist
and electroplating, we have fabricated many kinds of shadow
masks of upto 60um in thickness on the 4inch silicon wafer.
After electroplating nickel on the seed metal,
we peel off the nickel shadow masks by hand.  Some stress
can be observed if the size is about entirely 4inch, however,
we think the stress can be controlled by adding proper additives
in the nickel plating bath.

 I hope this will help you...

At 08:24 AM 99-02-04 CET, you wrote:
>Hello,
>
>We are using shadow contact masks made of Si for one of the
>metalization processes. They are fabricated by cutting holes wih
>laser in thin silicon wafers, so they can be very easily damaged
>during the alignment procedure. The alternative substrate for mask
>fabrication would be metal but the problem is the flatness of the
>mask after fabrication because we need around 100 holes on 100 mm
>wafer.
>
>Does anyone have experience with shadow masks and/or know the
>supplier of shadow masks made of metal?
>
>Wlodek Kaplan
>
>*