You may contact the company, Bullen Ultrasonics.
Their homepage is,
http://www.bullen-ultrasonics.com/
Chialun wrote:
> This is a multi-part message in MIME format.
>
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> MEMS Discussion Group,
> I am in search of a prototype manufacturing source for drilling =
> micro-vias on glass wafers. Laser drilling or sand blasting seems like =
> good candidates. I need holes of diameter of about 150 micrometers on a =
> 7740 glass wafer. Any help would be greatly appreciated.
>
> Chia-Lun Tsai, Ph.D.
> Research Scientist
> Integrated Sensing Systems, Inc.
> 387 Airport Industrial Dr.=20
> Ypsilanti, MI 48198
> Phone: (734) 547-9896, Ext.115
> Fax: (734) 547-9964
> Email: [email protected]
> http://www.mems-issys.com/
>
--
Sincerely,
~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~
Hyoung J. Cho
[email protected]
Center for Microelectronic Sensors and MEMS
391 ERC, Electrical Engineering Dept.
Univ. of Cincinnati
Cincinnati OH 45221-0030
Fax (513) 556-7326/7405
Phone (513) 556-4795/1997
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