Roy -

Are you bonding glass to silicon or silicon to silicon?  See our website at
www.sensorprepservices.com.  Call me to discuss.  I'll be in Muechen April
12-15 at SemiEuropa.

Regards,

Bill Stockdale

-----Original Message-----
From: Roy Knechtel 
To: [email protected] 
Date: Tuesday, March 23, 1999 3:42 PM
Subject: Test Metods for anodic bonded Devices?


>Hello,
>
>
>I have to test anodic bonded Devices. Can anybody send me some
>informations about the following test-topics.
>
>
>1. Bond Strength (static, dynamic Tets)
>
>2. Hermeticity
>
>3. mechanical Stress
>
>4. Life-Time Prediction
>
>
>and other Tests if known.
>
>
>
>Thanks=20
>
>
>Roy Knechtel
>
>
>xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx
>
>    =09
>
> X-FAB Gesellschaft zur Fertigung von Wafern mbH  =09
>
> Haarbergstra=DFe 61         Tel.: 03 61 - 420 53 - 28 =09
>
> 99097 ERFURT         Fax.: 03 61 - 420 53 - 28 =09
>
> GERMANY e-mail:      [email protected] =09
>
> =09
>
>xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx=09
>
>