Geng --

did you get any useful replies on your post? I have similar needs.

Thanks in advance for any help!

Isaiah

>Hi there,
>
>We would like to release an Al sacrificial layer (0.5 5m thickness) without
>affecting any
>other metal and dielectric layers in the structure.  An undercut rate of 100
>5m+ in 10
>min. is required.  The etchant should not attack PE oxide, nitride, Ti, Au.
>Any suggestions?
>Your help will be very much appreciated.
>Regards,
>
>G. Chen
>