Could I get advice about gold metalization schemes for contact to p-type
piezoresistive elements formed on bulk-micromachined pressure sensors that we
are making for a MEMS/uFab class. The boron surface doping is about 1E19.
The gold layer will be about .5 microns and will be sputtered.

Questions...What adhesion material is recommended? Can chromium be used?
Is a diffusion barrier needed? If so what material is recommended?
Any concerns or recommendations about electrical behavior and/or  contact
resistance? Do you know of any general references for gold metalization
schemes for electronic devices?

Thanks for any advice!!

--
Dr. Kevin M. Walsh
Electrical Engineering Department, Speed Scientific School
University of Louisville, Louisville, KY 40292
(502) 852-0826

Internet address: [email protected]