Chialun:

Good to hear from you. Well FIB as you know it s an ideal tool for
generating sub-micron features. Since your hole dia is 150 microns and depth
of 750 microns, we have other techniques in-house. We have modified our FIB
system and is being used as an maskless implantation tool. The implantation
process is fully automated and can handle any kind of CAD or Bitmap file
format. By combining our FIB patterning technique with RIE generating such
features should not be a problem. We are publishing a paper on some of these
technique we have developed at Norsam Technologies (http://www.norsam.com)
in HARMST'99 conference in Japan. Thank you and let me know if you have any
other questions or want us to help you in any way.

Regards
Jayant
******************************************************************
Jayant Neogi
Vice President & Chief Technical Officer
Norsam Technologies
Ph#  (503) 640-0586
Fax# (503) 640-8117
******************************************************************

-----Original Message-----
From: Chialun 
To: Jayant Neogi 
Date: Thursday, March 11, 1999 5:48 AM
Subject: Re: Micro-via on glass wafer


>Dear Jayant:
>   I'm very interested.  Our 7740 glass wafer is 750um thick, can you use
>FIB to drill such thick wafer in large numbers?
>
>Thanks very much,
>chialun
>
>-----Original Message-----
>From: Jayant Neogi 
>To: Chialun 
>Date: Wednesday, March 10, 1999 10:12 PM
>Subject: Re: Micro-via on glass wafer
>
>
>>Hi:
>>
>>We at Norsam Technologies can do this work for you, currently we are doing
>>very similar work for Caliper Tech. We are using Focused Ion Beam
>technology
>>to drill hole and can obtain holes as small as 12 nm. Let me know if we
can
>>be of any help to you. Thank you.
>>
>>Regards
>>Jayant
>>******************************************************************
>>Jayant Neogi
>>Vice President & Chief Technical Officer
>>Norsam Technologies
>>Ph#  (503) 640-0586
>>Fax# (503) 640-8117
>>******************************************************************
>>
>>-----Original Message-----
>>From: Chialun 
>>To: [email protected] 
>>Date: Wednesday, March 10, 1999 5:55 PM
>>Subject: Micro-via on glass wafer
>>
>>
>>>This is a multi-part message in MIME format.
>>>
>>>------=_NextPart_000_00B4_01BE6AE0.FC91E170
>>>Content-Type: text/plain;
>>> charset="iso-8859-1"
>>>Content-Transfer-Encoding: quoted-printable
>>>
>>>MEMS Discussion Group,
>>> =20
>>>
>>>  I am in search of a prototype manufacturing source for drilling =
>>>micro-vias on glass wafers.  Laser drilling or sand blasting seems like =
>>>good candidates.  I need holes of diameter of about 150 micrometers on a
=
>>>7740 glass wafer.  Any help would be greatly appreciated.
>>>
>>>
>>>Chia-Lun Tsai, Ph.D.
>>>   Research Scientist
>>>   Integrated Sensing Systems, Inc.
>>>   387 Airport Industrial Dr.=20
>>>   Ypsilanti, MI 48198
>>>   Phone: (734) 547-9896, Ext.115
>>>   Fax: (734) 547-9964
>>>   Email: [email protected]
>>>   http://www.mems-issys.com/
>>>
>
>