SEE:Chengqun Gui's Ph.D. Thesis on Direct bonding with CMP.." at University
og Twente, The Netherlands; and a book just published on Si-Si- Bonding by
C.Y. Tong and U. Gosele, Wiley Co. and their many papers on bonding.

Wen Ko

At 01:30 AM 3/23/99 +0100, you wrote:
>Dear,
>
>i'm working on my thesis about solar cells on IMEC (research center in
>Leuven, Belgium). But i'm stuck in a specific problem, and i'm looking
>for tips and advice to solve the problem.
>
>Problem: i can't bond a silicon wafer to a alumina-substrate(AL2O3
>99.9%).
>
>I've done some experiments without any success.
>Review of experiments:
>    A/ high temperature (10000C), short bonding time (6 hours), the
>bonding was          surrounded by N2-gas.
>        surface conditions of the wafer and substrate:
>            1. both surfaces are dry
>            2. both surfaces are dry and covered by a nitride layer
>            3. both surfaces are wet and covered by a nitride layer
>            4. both surfaces are wet and covered by an undoped pyrox
>layer
>
>    B/  low temp (2000C) , long time (26 hours), the bonding was
>surrounded by N2-gas.
>        1. both surfaces are wet and covered by a nitride layer
>        2. both surfaces are wet and covered by a doped pyrox (normally
>the pyrox has to become viscose)
>
>Some questions:
>+Is there anybody who has some experience with the bonding topics or
>somebody who's got usefull information?
>+ are there logical explanations why the experiments failed and this on
>the base of chemical or physical properties of the materials?
>+Do you have some suggestions for other experiments (use of other values
>
>for the parametres (temp, duration, surrounding gas, .......))?
>+Can you recommand some people or specific lecture related to the
>bonding problem?
>
>All tips and advice are welcome!
>Thanx a lot.
>Studentical greetings.
>
>Stijn Lenaerts
>    student 'engineer in micro-electronics', KULeuven Belgium
>    thesisstudent on IMEC
>
>email:
>    [email protected]
>address:
>    steengroevenlaan 5/5/0
>    3001 Heverlee
>    Belgium
>fax:
>    +32 16 20.65.29
>
>
>
>
>
>Is there anybody who has some experience with the bonding topics or
>somebody who's got usefull information? All information and tips are
>welcome!
>
>Thanx a lot.
>
>Stijn
>University KULeuven (belgium)
>
>
>
>
>
>
Wen H. Ko
Phone: 1-216-368-2071
FAX: 1-216-368-5326
e mail: [email protected]