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MEMSnet Home: MEMS-Talk: Vacuum Sealing/Enacapsulation
Vacuum Sealing/Enacapsulation
1999-01-07
David DeRoo
Vacuum Sealing/Enacapsulation
David DeRoo
1999-01-07
MEMS Discussion Group,

I am currently working on a micromachined sensor which requires packaging in
a vacuum environment.  I am in search of a prototype manufacturing source
for vacuum sealed packaging of MEMS devices and IC's.  Vacuum levels of
1-10mTorr are required.

Likewise, I am also in search of a prototype/manufacturing source with
experience encapsulating die at the wafer level preferably in a vacuum (we
are already working with most of the major foundry suppliers).

We are now in a prototype phase so I only need a small number of packaged
devices, but eventually expect to put this device into high-volume
production (10M+/year).

Regards and Thanks,

Dave DeRoo
Product Manager - Sensors
MicroSensors, Inc.

(714) 444-8816
(714) 540-8816 Fax
[email protected]

3001 Redhill Ave. Suite 3-104
Costa Mesa, CA 92626


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