Hello MEMS Community,

We are a supplier of Quartz wafers and can supply 500um thick 10mm wafers.

However to have them cut in this manner is difficult and very expensive.
There are two ways that I am familiar with accomplishing circular dicing.

#1.) Cutting Wheel: This method will require the wafer to be held in place
and re polishing after cutting due to chuck marks.

#2.) Laser cutting: Since a Quartz wafer is transparent the Laser has a
very difficult time reading the wafer.  This makes this process very
difficult and also expensive to do.

I hope this offers some useful information for you.

Best regards,




At 09:49 AM 4/23/99 -0700, John D. Evans wrote:
>
>MEMS Community,
>
>I am interested in dicing up a 500 um quartz wafer into circular dice,
>roughly 10 mm diameter. I have two questions:
>
>1) What technologies and companies are available to do the cutting
>(preferably in California)?
>
>2) How do you hold the wafer and dice during cutting? If you hold the wafer
>only, then the circular parts will fall into the cutting stream/beam and
>get damaged. Is there a way to hold the individual dice? Is there a
>substrate that doesn't get cut that you can "glue" to both the wafer and
dice?
>
>Any suggestions appreciated.
>
>Thanks,
>
>John D. Evans
>Silicon Waterworks
>
>
>
Roger Neef
Silicon Valley Microelectronics, Inc.
North America Wafer Division
Tel: 408-436-2351
Fax: 408-436-8402
WWW.SVMI.COM