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MEMSnet Home: MEMS-Talk: Re: Electrostatic Bonding Of Si Wafers
Re: Electrostatic Bonding Of Si Wafers
1996-04-03
Ed Kolesar
1996-05-15
Robert Santilli
Re: Electrostatic Bonding Of Si Wafers
Ed Kolesar
1996-04-03
Three sources of MEMS-related fabrication information include:

 1. S.M. Sze (ed.), Semiconductor Sensors, John Wiley and Sons, Inc., NY, NY,
    1994 (especially Chapter 2 and the references at the end of the chapter).
 2. Julian W. Gardner, Microsensors - Principles and Applications, John Wiley
    and Sons, 1994 (especially Chapter 3 and the references at the end of the
    chapter).
 3. C.D. Fung, P.W. Cheung, W.H. Ko and D.C. Fleming (eds.), Micromachining and
    Micropackaging of Transducers, Elsevier, Amsterdam, 1985 (especially the
    chapter by W.H. Ko, J.T. Suminto and G.H. Yeh, "Bonding Techniques for
    Microsensors," pp. 41-62).

Best regards,

Ed Kolesar


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