You may want to try Bond Optics Inc. in Leabanon, New Hampshire. Phone:
603-448-2300. One of they're specialties is fabrication of precision components
in Corning 7740. Ask for Ed Guraldi....

 ==================================================================
| Robert L. Wood                                                   |
| MCNC, MEMS Technology Applications Center                        |
|                                                                  |
| MCNC, PO Box 12889, Research Triangle Park, NC 27709-2889        |
| email: [email protected] * voice: (919)248-9284 * fax: (919)248-1455|
| URL:   http://mems.mcnc.org/                                     |
 ==================================================================
On Mon, 1 Apr 1996, Jim Beall wrote:
> I am looking for a supplier of
>         Corning 7740 (or equiv) substrates
>                 thickness 8 mils (+/-)
>                 diameter 2-4"
> to be used for bonding silicon wafers.
>
> Any pointers would be appreciated, especially suppliers that
> may have substrates in stock.
>
> Thanks in advance,
>
>
>
>  - Jim Beall 303-497-5989
>    [email protected]
>
>
>
>


From "Dr. Kevin Walsh"[email protected] Mon Jan 22
16:18:22 1996
To: [email protected]
Subject: TMAH Question
From: "Dr. Kevin Walsh" [email protected]>
Date: Mon Jan 22 16:18:22 1996
Status: O
Content-Length: 1166
Lines: 23

Dear MEMS researcher,

We are doing some research with 10% TMAH. We are dissolving silicon in the
solution for passivation against aluminum etching. The problem that we are
experiencing is the following. We are obtaining erratic via etching across a 4"
wafer. Some patterns will etch nicely and yield clean vias. Other patterns will
etch erratically and produce vias that are only 50-90% through. In those vias,
there are areas of silicon that are left behind. Still other patterns will etch
only slightly, some hardly at all. We do not believe that the problem is
related to either our etching setup or patterning process because we have been
able to obtain clean and uniform vias using KOH. We have also found that if the
wafer has neg resist remaining on its surface, this will apparently contaminate
the TMAH and cause si etching to cease. Can someone with more TMAH etching
experience than me drop a note regarding any suggestions or TMAH
idiosyncrasies?

Thanks,

Dr. Kevin M. Walsh
Electrical Engineering Department, Speed Scientific School
University of Louisville, Louisville, KY 40292
(502) 852-0826
Internet address: [email protected]