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Oliver,

Here are some abstracts I found regarding spray coat photoresist.  Hope it
helps.

Regards,


Spray Coating for MEMS, Interconnect &
   Advanced Packaging Applications

   Thomas Luxbacher, Ph.D.
   EV Group
   Schärding, Austria

                           Andy Mirza, Ph.D.
                           EV Group, Inc.
                           Phoenix, Arizona, USA


                                                      Abstract:
                                                      A new process of spray
coating of a photoresist thin film
                                                      on a silicon wafer
substrate with extensive topography is
                                                      presented. The adaptation
of the widely used
                                                      spray-coating technology
to
the semiconductor business
                                                      area will meet the future
demands of the microelectronic
                                                      and micro-
electromechanical
systems (MEMS) industrial
                                                      markets. The availability
of the spray coating processes
                                                      for IC and MEMS
fabrication
will facilitate the
                                                      development of highly
integrated device structures.
                                                      Furthermore, substrates
with square shapes and MEMS
                                                      devices with extreme
topography in height and size can
                                                      be covered with a uniform
resist layer thus meeting the
                                                      requirements of subsequent
photolithographic steps.

                                                      Published: HDI Magazine,
May 1999





   Newest Developments in MEMS
   Manufacturing Equipment

   Paul Lindner
   EV Group
   Schärding, Austria


                           Satoshi Frank Shiraki
                           EV Group Japan KK
                           Shin-Yokohama, Japan



                                                      Abstract:
                                                      This paper informs about
the progress in state-of-the-art
                                                      MEMS manufacturing
equipment. As general system
                                                      component the wafer
handling will be reviewed in detail:
                                                      - Wafer handling system
for
MEMS.
                                                      Key enabling equipment
technologies have been further
                                                      developed for the specific
needs of MEMS devices and
                                                      will be demonstrated:
                                                      - Advanced wafer bonding
technologies
                                                      - A new Coating technology
for MEMS
                                                      - SmartViewTM alignment
and
its possibilities

                                                      Published at: SEMI 3rd
Microsystem/MEMS Seminar
                                                      Semicon Japan, December 1,
1999


   Technical Requirements for MEMS
   Equipment


   Paul Lindner
   Product Manager
   EV Group
   Schärding, Austria



                                                      Abstract:
                                                      This paper describes
equipment requirements for
                                                      realizing
microelectromechanical systems (MEMS) for
                                                      research and volumne
production. An overview of
                                                      lithography, wafer bonding
and resist coating processes
                                                      involved in MEMS
manufacturing is given. Advantages
                                                      and disadvantages of these
processes and their
                                                      influence on equipment
requirements is highlighted

                                                      Published at: SEMI
Micromachine/MEMS Seminar -
                                                      Semicon Japan, Dec. 3,
1998







   Advances in MEMS Wafer Processing
   Equipment


   A. R. Mirza, PhD
   Technology Manager
   EV Group, Inc.
   Phoenix, Arizona

                                                      Abstract:
                                                      This paper reviews
progress
in state-of-the-art MEMS
                                                      (Microelectromechanical
Systems) wafer processing
                                                      equipment. We will discuss
three key enabling
                                                      technologies for the
realization of commercial MEMS
                                                      devices, namely; aligned
wafer bonding,
                                                      front-to-backside
photolithography and customized resist
                                                      coating (double-side
coating and thick resists). We will
                                                      demonstrate the
scalability
of MEMS wafer processes
                                                      from R&D equipment to
fully
automated systems with
                                                      robotic handling. This
issue is a point of vital concern for
                                                      any MEMS process
technology
transfers from
                                                      development to high-volume
manufacturing. The specific
                                                      needs of MEMS devices that
impact on equipment
                                                      design will be discussed,
including the high-level
                                                      integration of different
wafer processes into one machine.

                                                      Published at: "THE
COMMERCIALIZATION OF
                                                      MICROSYSTEMS  98" SAN
DIEGO, CA September
                                                      13

Oliver Powell wrote:

> Dear Mems people
>
> I am trying to perform a second photolithography step on islands which I
> have etched to a height of 20 to 40 microns.  Unfortunately I am finding that
> my photoresist seems to runn off and end up in puddles at the bottom of the
> islands and much too thin on the top (or not at all)
>
> I was thinking of spraying on my photo resist instead of spinning.  Has
> anybody
> tried this??  Can anybody suggest another way to avoid this problem.
>
> cheers
>
> Olly Powell
> School of microelectronic engineering
> Griffith University
> Australia
>
>

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