Dear Peter Goetz,

Corning has glasses with similar CTEs as GaAs.  Some customers purchase drilled
wafers of these glasses as substrates for GaAs processing. They epoxy-bond the
drilled wafers onto the backside of the GaAs wafer, do the CMP or other
proccessing, then remove the epoxy through the holes in the glass.

Contact me if this is what you had in mind "to protect the backside of a GaAs
wafer during processing".

Regards,
Dan

Daniel S. Lapp
Product Manager
Corning Incorporated
HP CB 8-3
Corning, NY 14831

TEL:     607-974-4329
FAX:     607-974-7618
E-Mail:  [email protected]


> ----------
> From:         Peter Goetz[SMTP:[email protected]]
> Reply To:     [email protected]
> Sent:         Thursday, September 14, 2000 2:31 PM
> To:   [email protected]
> Subject:      Protection of Backside during processing
>
> Any good ways to protect the backside of a GaAs wafer during processing?
> Any specific photoresists or metals that people have sucessfully used?
>
> Thanks,
>
> Peter Goetz
> [email protected]
>
>
>