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MEMSnet Home: MEMS-Talk: Q: Dry Processing to increase adhesion Cu to Si3N4
Q: Dry Processing to increase adhesion Cu to Si3N4
2000-10-18
Erik Jung
Q: Dry Processing to increase adhesion Cu to Si3N4
Erik Jung
2000-10-18
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Dear colleagues,
we need to deposit a 0.5um Cu layer on 1/2"x1/2" pieces of silicon. As
in large sputter equipment, these pieces tend to dissappear in the
vaccuum duct, we plan to go into a smaller sputter unit, having a Cu
target only. Is there a way to ensure adhesion of the Cu, keeping in
mind the small outer dimensions of the silicon?
Thank you!

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