Hi everyone,

I need to deposit about 5 microns of metal( copper, gold, anything)
on silicon wafer. Since we don't have CVD or sputtering facility,
electroplating seemed like a good idea. I don't need the metal layer to
have very good electrical characteristics. Whatever reference I have come
across about electroplating on silicon, talks about some seed metal layer
already present on the wafer. Can anyone tell me what is the conventional
way of getting that seed layer? Is it by electroless plating? If so, what
are the conditions (e.g. activation steps, plating solution, temp etc.)?
Any step-by-step guide or reference about it will be most welcome.

Thank you all in advance,
With best regards,

Ms.Debjani Pal

Research Scholar (Semiconductor Group)
Department of Physics                 Ph: (080)309-2316
Indian Institute of Science           Fax:(080)334-1683
Bangalore - 560012