Dear Weng on,

Maybe you can try to oxidize selectively the wafer in the points where you
would like to make the bondings with a very thin layer of oxide, place the
sample in an oxygen plasma for 1 min to activate the surface and then put
together the two samples and apply heat.

Regards,

Sonia.
--------
Sonia Garcia Blanco
Department of EE
University of Glasgow
G3 8PP
Glasgow



On Tue, 28 Dec 1999, choong weng on wrote:

> Dear All,
>
>   I need to bond two wafers but selectively at certain
> locations only.  Please provide me any information
> with regards to selective wafer-wafer bonding?  Thank
> you very much.
>
> Weng On
>
>
>
> =====
> Best Regards,
> Yongan
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