I am looking for sources and ways of vacuum packaging a resonant transducer.
Any pointers the MEMS commuity could give to me as
someone from a non-MEMS background would be gratefully received.

The guidance I am seeking is on 2 topics:

(i) Sources for in-can vacuum packaging (including bonding)

(ii) Methods of on-chip / wafer level vacuum packaging - particularly those
that are CMOS compatible and/or allow electrical connections to be made from
inside to outside the vacuum. Are there any providers of this solution
commercially available?

I will collect and post any replies. Thanks for you help,

Karen Smith
Consultant Engineer
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