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MEMSnet Home: MEMS-Talk: Wafer Dicing
Wafer Dicing
2000-10-17
Blasczak, Gail
2000-01-21
Jerome Hauden
Wafer Dicing
Jerome Hauden
2000-01-21
Hi everybody,

I saw in an old paper that some guys are able to cut Lithium niobate in
such a way that they don't have to end polish after cutting.

Does anyone got an idea about this method?

I'm currently using classical diamond dicing. Tried different parameters
but never got something enough clean to avoid end polishing.

Thanks for any information, that's would be of great help.

Jerome
.....................................................
Dr. Jerome HAUDEN, Professor Assiocate
Laboratoire d'Optique PM Duffieux
UMR CNRS 6603 - Universite de Franche Comte
16 Route de Gray - 25030 Besancon cedex - France

tel: (33) 381 66 64 24 / fax: (33) 381 66 64 23
http://imfc.univ-fcomte.fr/lopmd/
.....................................................


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