I have posted a question regarding to chromium evaporation using ebeam and
lots of people give me suggestions. Thank you all very much!

Recently I am trying to evaporate platinum using ebeam and I have
encountered some problems. I had successfully deposited a layer of platinum
with 0.7um thickness (use Ti as adhesion layer). But if I deposite 1um or
above, the platinum all come off in the form of little pieces. Wonder why?
So I have following questions:

1. Is it possible to deposit platinum using ebeam?
2. What is the normal deposition rate?
3. What is maximum thickness of the film without delamination?
4. Does substrate heating help?
5. What is the recommanded crucible (liner) for platinum?
6. Which adhesion layer is better: Ti or Cr?

BTW, where can I find information regarding to the recommended liners for
specific metals? Is there a table available?

Your help is very much appreciated!

Jessie Zhang
Paratek Microwave, Inc.
443-259-0140 x153
[email protected]