Announcing the Second Multi-Project LIGA run

MCNC, in conjunction with the University of Wisconsin, and with support from
ARPA, is pleased to announce the second multiproject LIGA run scheduled for
this fall/winter.

This run will feature 2 distinct processes, both completely releasable. One
process will be a 150 micron tall electroplated nickel process with a milled
final surface. This process can be used for all/any structures with a minimum
line width of 5.0 microns or greater, AND a length-to-width aspect ratio of
10.0 or less.

The second process, which is offered specifically to accommodate those
participants interested in producing gratings, is a 30 micron tall
electroplated nickel process. The top surface will not be milled. This process
has also has a 5.0 micron minimum geometry, but has no length-to-width aspect
ratio restriction.

Detailed design rules and layout examples will be provided to all interested
users. Contact [email protected], 919 248 1493 for LIGA rules (rule handouts
will be available starting week of sept 5) and reservations.

The design deadline is OCTOBER 31, 1994.

Layout support is available (contact [email protected], 919 248 1424). If you
desire layout support from MCNC, your design requirements are due NO LATER THAN
OCTOBER 17th.

The run cost is $600. Five (5) die will be delivered.

The number of available die are limited, reservations are on a first-come,
first-served basis. Payment is due with your design submission.

Please DO NOT CONTACT THE UNIVERSITY OF WISCONSIN for information, reservations
or rules. All activity will be handled by MCNC.