Dear All,

We have silicon chips with both top and bottom etch, both are all- along-
chip channel. Etch on the top is deep while etch on the bottom is shallow.
After dicing, the PR coat on the top and some silicon debris come into the
bottom channel. I am wondering if you can give me some advice to remove the
backside contamination without manual chip- by- chip operation.

Thank you.

Connie Wang