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MEMSnet Home: MEMS-Talk: why there will be a 54.7 degrees when wet etching a silicon wafer with KOH
why there will be a 54.7 degrees when wet etching a silicon wafer with KOH
2001-08-28
Oscar Hui
why there will be a 54.7 degrees when wet etching a silicon wafer with KOH
Oscar Hui
2001-08-28
Dear Sir,

hi................could you explain it to me why there will be a 54.7
degrees when wet etching a silicon wafer with KOH. is that it relate to
the planar orientation of plane 111, plane 110 and plan 100.

please give me an explanation in detail.


thanks heartily.





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