Pt should indeed solve your problems.  I have
fabricated Ti/Pt thin-film heaters, and I have found
that the resistance does change after bonding, but the
change is nothing near what you describe.  In my
films, I observe oxidation of the Ti and some
diffusion into the Pt (hillocks form in film), but the
resistance change is minimized.  I use Ti instead of
Cr as the adhesion layer because I have observed
delamination of the Cr after bonding as compared to
the Ti.  Hope this helps.

                                Eric


Hi there,

I experienced that the electric resistivity of Cr/Ni
thin-film
resistor was drastically increased after a thermal
glass-glass bonding.
The Cr/Ni thin-film (200/2000 angstroms) was
evaporated down the glass
sunbstrate using E-beam.The bonding process condition
was: 650 degC, 6
hours. The resulted resistance was very huge. I
suspected the Ni film
was oxidised during the bonding process because I
didn't use vacuum
condition.
I think the Pt could void this problem becase of its
good thermal
property. Does any one know how to solve this problem?
I appreciate
your
help very much.

Wei





=====
Eric Lagally
UCB/UCSF Joint Bioengineering Graduate Group
Mathies Research Laboratory
313 Lewis Hall
Berkeley, CA 94720

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