Hello,
you can use Ti as a seed layer,the etchant is (20 H2O : 1 H202 : 1
HF).Etching is done at room temperature.Etch rate is about 9000 A/min.
Hope this helps.
Andrey

On Sat, 29 Sep 2001, Onnop Srivannavit wrote:

> Hi everyone.
>
> I would like to use Cu plating on glass to form
> surface micromachining device. I wonder what kind of
> seeding layer should be used. I also want to know
> etchant for that seeding layer. Thanks very much for
> your help.
>
> Best Regards,
>
> Onnop
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