Jeff,

Any reason that you do not want a WET dicing process on your wafers ?
Sources are much more abundant and some can do partial cut through for
break or full cut  through on tape with pick and place, depending on
'chip' size, otherwise they can do the full cut dicing  and leave it on
tape. Dicing will give you a much cleaner , chip free edge, especially
at bottom where the break often will cause some cleaving leaving one
chip with an undercut and another with a protrusion at the bottom.



Best Regards,
Ken Smith

Kmbh Associates
4968 Charter Road
Rocklin, CA  95765  U  S  A
510-714-5055 Efax- 510 217 4421 or 561 658 6136

High Purity Float Zone and Specialty CZ Silicon  for Power, IR and
Mirror Optics, Optoelectronics, MEMS, SOI, and other Semiconductor
applications. Service in SOI, Polishing SSP and DSP.

"Hawkins, Jeff" wrote:
>
> Hi,
> Does anyone know where I can procure Si wafer "Dry" scribe and break
> services? (Loomis/Dynatex or similar process equipment)
>
> My previous supplier (SpectraChip) appears to be no longer in business.
>
> Thank You
>
> Jeff Hawkins
> Project Engineer
> General Eastern Instruments
> 20 Commerce Way
> Woburn, MA
> 01801
> (781)938-7070 x 206
> FAX:(781)938-1071
> [email protected]