Dear Mems Experts,
We are looking fro new materials for micropackaging and we are very
interested in patternable and photocurable PolyDiMethylSiloxane.
Do you know if the adhesion quality of this material is better than for
BCB?
Could you give me some reference about articles or publications
concerning the utilization of this kind of material?
Could you give me the name of  Industries producting this kind of
material?
Thank you very much.
Best regards.

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Dr. Paolo Bondavalli
R&D Engineer
LABCOM - Laboratoire Interconnexions Optiques et MEMS
THALES (ex THOMSON-CSF) CORPORATE RESEARCH CENTER
Domaine de Corbeville,
Route Departementale 128
F91404 ORSAY
(FRANCE)
Tel : 01 69 33 08 63
Fax : 01 69 33 08 62
Email : [email protected]
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