Folks:

Please, I have a need for extremely deep RIE (300-600 microns) of array of
structures in silicon.

Alternatively, high resolution EDM or ultrasonic drilling will be
acceptable.  However, due to wafer stacking, the misalignment should be
within +/- 5 microns.

This project has evolved beyond fundamental research, therefore, interested
parties should have well-established process parameters or close to such.

There will be about 15 wafers, of which 5 will be 300 microns thick and the
others 600 microns - all through holes

Target delivery date: January 31, 2002.

Thanks.



Robert S. Okojie, Ph.D.
NASA-Glenn Research Center
Sensors and Electronics Branch
21000 Brookpark Road, M/S 77-1
Cleveland, OH 44135.
Ph: 216/433-6522;       Fax: 216/433-8643
e-mail: [email protected]