You might try a material called "crystal bond" from Aremco
(www.aremco.com) or any type of hot wax used for polishing
applications. These materials typically melt around 1400C

Please post your findings!
MbR,
Erik
> Hello;
>
> I'm having the classic problem of masking resist failure during Deep
RIE
> etching (STS Etcher).  I have a 70um thick 4" Silicon substrate that
must
> be mounted on a handle (carrier) wafer prior to photolith and Deep
RIE
> etching.  I have experienced repeated failures with resist mounting
> (gluing) techniques (presumably from masking resist loss due to
> overheating) and am looking for a better mounting procedure or
'glue'.
> The wafer must be able to be released easily from the handle after
etching
> and can not tolerate temperatures over ~170C.
>
> The generic recipe I have used for resist mounting of the thin
substrate
> is to spin on ~1.6um resist on the handle and to bring the wafers in
> contact before baking.  Aluminum foil is placed over the wafer
sandwich
> and a weight (2 pounds) is placed on the wafers.  The assembly is
baked at
> 100C for 1-3 hours.  I notice significant resist flow (observed
after
> failure) resulting in poor adhesion and likely poor cooling.
>
> Can you recommend a better glue or gluing technique to address the
needs
> of thin substrate mounting for Deep RIE etching?
>
> Thank you very much, Jack
>
>
>       Jack Kotovsky                   (H) (530) 758-6278
> _______________________________________________
> [email protected] mailing list: to unsubscribe or change your
list
> options, visit
http://fab.mems-exchange.org/mailman/listinfo/mems-talk
> Hosted by the MEMS Exchange, providers of MEMS processing services.
> Visit us at http://www.mems-exchange.org/
>
>
BITTE NICHT AN DIESE MAILADRESSE ANTWORTEN!
Erik Jung FhG-IZM