> -----Original Message-----
> From: Paolo Bondavalli
>
> I 'm looking for information about pyrex deep etching.
> Actually, we would like to realize some cicular micro-covers starting
> from a pyrex wafer. These covers have a diameter of around 2 mm.

We fabricated some glass chips with a diameter of 2 mm (thickness 500
micron). Powder blasting was used to "cut" them out of the wafer, which is a
very fast process. For more info on powder blasting:
http://www.el.utwente.nl/tt/projects/blast/


Greets,

Henk Wensink


EL/TN 7148
MESA+ Research Institute
University of Twente
P.O. Box 217, 7500 AE Enschede
The Netherlands