Xing Yang-

I know that Electroless Ni plating is commonly used as a barrier layer
between Cu traces and Au pads on laminate based [PWB} chip carriers. I'm not
certain what processes are used on wafers.



Michael Alderete
Lead Mechanical Packaging Engineer
DRS Sensors & Targeting Systems, Inc.
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Anaheim CA 92806

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You wrote...


Message:        1
From:   Xing Yang  >
To:     [email protected] 
Date:   Fri, 16 Nov 2001 14:41:04 -0800 (PST)
Subject:        [mems-talk] electroplated Au

I am trying to get some pure electroplated Au surfaces on top of Cu.  What I
found out is that there are lots of Cu on top of the electroplated Au
surface which I assume is due to the Cu diffusion. Does anyone know a good
diffusion barrier layer that can be plated between Cu and Au?
Any info is appreciated.
Xing Yang